Pioneering the future with precision components for semiconductors GOTOH MFG Co., Ltd.
TEL. +81 197-66-6051
1-17 Kitakogyodanchi, Kitakami-shi, Iwate 024-0002 JAPAN
TECHNICAL INFORMATION
Gotoh's Solution
CASE03. Solder Joint Reliability
Customer Challenges
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Our Solutions
Full-Perimeter Ag Spot Plating |
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Improves solder wettability, fill performance, and uniformity in through-hole joints |
Customer Benefits
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- SiC MOSFET Modules for Automotive Applications
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Our Competitive Advantages
- Tech Expertise Built on Customer Challenges
- Delamination Resistance (Selective Texturing Technology)
- High Heat Resistance, Strength and Electrical Conductivity
- Solder Joint Reliability
- Mold Flash Resistance
- Assembly Productivity
- Resource Efficiency
- Design & Development Efficiency
- Automotive-Grade Quality Assurance System
- Stable Supply (BCP)
GOTOH MFG Co., Ltd.
1-17 Kitakogyodanchi, Kitakami-shi, Iwate
024-0002 JAPAN
TEL +81 197-66-6051
FAX +81 197-66-6060